Invention Application
- Patent Title: ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME
- Patent Title (中): 阵列基板和安装集成电路的方法
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Application No.: US14526182Application Date: 2014-10-28
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Publication No.: US20150366049A1Publication Date: 2015-12-17
- Inventor: Dae Geun LEE
- Applicant: Samsung Display Co., Ltd.
- Priority: KR10-2014-0073756 20140617
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/11
Abstract:
An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.
Public/Granted literature
- US09591754B2 Array substrate and method of mounting integrated circuit using the same Public/Granted day:2017-03-07
Information query
