Invention Application
US20150364656A1 LED PACKAGING STRUCTURE AND METHOD, DISPLAY DEVICE AND ILLUMINATING DEVICE
有权
LED包装结构和方法，显示装置和照明装置
- Patent Title: LED PACKAGING STRUCTURE AND METHOD, DISPLAY DEVICE AND ILLUMINATING DEVICE
- Patent Title (中): LED包装结构和方法，显示装置和照明装置
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Application No.: US14495546Application Date: 2014-09-24
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Publication No.: US20150364656A1Publication Date: 2015-12-17
- Inventor: Tao WANG
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
- Priority: CN201410270528.0 20140617
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/08 ; H01L33/58
Abstract:
According to an LED packaging structure and packaging method thereof provided by the present disclosure, the LED may comprise a support having a cavity and at least one LED chip placed in the cavity. After the cavity is filled with a fluorescent adhesive, at least one concave lens structure may be formed at a light emitting side of the LED chip.
Public/Granted literature
- US09281455B2 LED packaging structure having concave lens structure at light-emitting side of LED chip Public/Granted day:2016-03-08
Information query
IPC分类:
