A module for detecting a vibrational behavior of a mechanical component includes an attachment component configured to be rigidly mechanically connected to the mechanical component in order to absorb a mechanical vibration of the mechanical component, a circuit board including a circuit, the circuit board being configured to detect the mechanical vibration of the mechanical component and, based on the detected vibration, to wirelessly transmit a signal indicative of the vibrational behavior, and at least one spacer mechanically connecting the circuit board to the attachment component such that the mechanical vibration is transferable from the attachment component to the circuit board.