发明申请
- 专利标题： RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- 专利标题（中）： RIBBON BONDING工具及其使用方法
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申请号： US14705341申请日： 2015-05-06
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公开(公告)号： US20150235983A1公开(公告)日： 2015-08-20
- 发明人: Mark A. Delsman , Theodore J. Copperthite , Garrett W. Jones , Todd J. Walker , Tick-Kwang Loh , Jay C. McCandless
- 申请人： Orthodyne Electronics Corporation
- 申请人地址： US DE Wilmington
- 专利权人： Orthodyne Electronics Corporation
- 当前专利权人： Orthodyne Electronics Corporation
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K20/10 ; B23K20/00
摘要：
A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
公开/授权文献
- US09929122B2 Ribbon bonding tools and methods of using the same 公开/授权日：2018-03-27
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