WAFER CLAMP FOR CONTROLLING WAFER BOWING AND FILM STRESS

Invention Application

US20150235892A1 WAFER CLAMP FOR CONTROLLING WAFER BOWING AND FILM STRESS 审中-公开

Title translation: 用于控制波浪和薄膜应力的波形夹

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Patent Title: WAFER CLAMP FOR CONTROLLING WAFER BOWING AND FILM STRESS
Patent Title (中): 用于控制波浪和薄膜应力的波形夹
Application No.: US14183291

Application Date: 2014-02-18
Publication No.: US20150235892A1

Publication Date: 2015-08-20
Inventor: Yunxiao Gao , Cherngye Hwang , Xavier C. Lelong , Stefan Maat , Bruce W. Saxton , Charles G. Seegel, III , Yong Shen
Applicant: HGST Netherlands B.V.
Main IPC: H01L21/687
IPC: H01L21/687

WAFER CLAMP FOR CONTROLLING WAFER BOWING AND FILM STRESS

Abstract:

A wafer clamp according to one embodiment includes an outer ring, and at least three members extending inwardly from the outer ring, each of the members having a contact area for engaging a wafer. A system includes a structure having at least one ring, each ring being for receiving a wafer, and a wafer clamp configured to clamp a wafer to each ring, the wafer clamp having an outer ring, and at least three members extending inwardly from the outer ring, each of the members having a contact area for engaging a wafer.

Abstract(Chinese):

根据一个实施例的晶片夹具包括外环，以及从外环向内延伸的至少三个构件，每个构件具有用于接合晶片的接触区域。一种系统包括具有至少一个环的结构，每个环用于接收晶片，以及晶片夹，其构造成将晶片夹持到每个环，所述晶片夹具具有外环，以及至少三个从外部向内延伸的构件每个构件具有用于接合晶片的接触区域。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/67	.专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置
H01L21/683	..用于支承或夹紧的（用于定位、定向或对准的入H01L21/68）
H01L21/687	...使用机械装置的，例如卡盘、夹具或夹子