Invention Application
- Patent Title: Electronic Device and Method for Fabricating an Electronic Device
- Patent Title (中): 电子装置及其制造方法
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Application No.: US14165769Application Date: 2014-01-28
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Publication No.: US20150214204A1Publication Date: 2015-07-30
- Inventor: Manfred Schindler
- Applicant: Infineon Technologies AG
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/31 ; H01L23/00 ; H01L25/00 ; H01L23/495
Abstract:
A method for fabricating an electronic device includes simultaneously attaching a first and a second semiconductor chip to a carrier using a transfer means, wherein attaching the first semiconductor chip includes a first attaching method and attaching the second semiconductor chip includes a second attaching method different from the first attaching method.
Information query
IPC分类:
