发明申请
- 专利标题: PROCESS AND SYSTEM FOR TREATING FLUID
- 专利标题(中): 用于处理流体的方法和系统
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申请号: US14163261申请日: 2014-01-24
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公开(公告)号: US20150214035A1公开(公告)日: 2015-07-30
- 发明人: Shing-Fong WU , Yung-Ti HUNG , Shih-Pao CHIEN , Yen-Chen CHEN
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; C11D11/00 ; B01F5/10 ; B01F3/04 ; B01F15/02 ; H01L21/67 ; C11D7/04
摘要:
Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.
公开/授权文献
- US09789448B2 Process for treating fluid 公开/授权日:2017-10-17
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