Invention Application
- Patent Title: Integrated Mechanical Device with Vertical Movement
- Patent Title (中): 具有垂直运动的集成机械装置
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Application No.: US14517369Application Date: 2014-10-17
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Publication No.: US20150116072A1Publication Date: 2015-04-30
- Inventor: Christian Rivero , Pascal Fornara , Antonio di-Giacomo , Brice Arrazat
- Applicant: STMicroelectronics (Rousset) SAS
- Priority: FR1360538 20131029
- Main IPC: H01H61/02
- IPC: H01H61/02 ; H01H1/58 ; H01H9/02
Abstract:
A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.
Public/Granted literature
- US10157720B2 Integrated mechanical device with vertical movement Public/Granted day:2018-12-18
Information query
