发明申请
- 专利标题： Multi-Layer Structures and Methods for Forming
- 专利标题（中）： 多层结构和形成方法
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申请号： US14587883申请日： 2014-12-31
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公开(公告)号： US20150108004A1公开(公告)日： 2015-04-23
- 发明人: Adam L. Cohen
- 申请人： University of Southern California
- 主分类号： C25D5/10
- IPC分类号： C25D5/10 ; C25D5/22
摘要：
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
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