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发明申请
US20150101752A1 SUBSTRATE PERIPHERAL PORTION MEASURING DEVICE, AND SUBSTRATE PERIPHERAL PORTION POLISHING APPARATUS 审中-公开
基板外围部分测量装置和基板外围部分抛光装置

SUBSTRATE PERIPHERAL PORTION MEASURING DEVICE, AND SUBSTRATE PERIPHERAL PORTION POLISHING APPARATUS
摘要：
A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
摘要（中）：

投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。 信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。 监视被抛光的周边部分的状态。 此外，检测到抛光终点。 也可以使用激光以外的透射波。 周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。 即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。

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