Invention Application
- Patent Title: FIN FORMATION BY EPITAXIAL DEPOSITION
- Patent Title (中): 通过外来沉积形成的FIN形成
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Application No.: US14269417Application Date: 2014-05-05
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Publication No.: US20150050800A1Publication Date: 2015-02-19
- Inventor: Adam Brand , Bingxi Wood , Errol Sanchez , Yihwan Kim , Yi-Chiau Huang , John Boland
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/66

Abstract:
Methods of forming a fin structure for a field effect transistor are described. The methods may include the operations of patterning a mandrel on a surface of a substrate, and depositing an epitaxial layer of high-mobility channel material over exposed surfaces of the patterned mandrel. The epitaxial layer leaves a gap between adjacent columns of the patterned mandrel, and a dielectric material may be deposited in the gap between the adjacent columns of the patterned mandrel. The methods may also include planarizing the epitaxial layer to form a planarized epitaxial layer and exposing the columns of the patterned mandrel, and etching at least a portion of the exposed columns of the patterned mandrel and the dielectric material to expose at least a portion of the planarized epitaxial layer that forms the fin structure.
Public/Granted literature
- US08999821B2 Fin formation by epitaxial deposition Public/Granted day:2015-04-07
Information query
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