Embodiments of the present disclosure are directed towards techniques and configurations for using projection patterning in making an electronic substrate with an embedded die. In one embodiment, a method may include providing a die embedded in dielectric material of a substrate, and projecting a laser beam through a mask with a preconfigured pattern to create a projected mask pattern on a surface of the dielectric material in accordance with the preconfigured pattern. The projected mask pattern may include a via disposed over the die. Other embodiments may be described and/or claimed.