Invention Application
US20150029067A1 RF SIGNAL PICKUP FROM AN ELECTRICALLY CONDUCTIVE SUBSTRATE UTILIZING PASSIVE SLITS
审中-公开
使用被动SLITS的电导体基板的RF信号拾取
- Patent Title: RF SIGNAL PICKUP FROM AN ELECTRICALLY CONDUCTIVE SUBSTRATE UTILIZING PASSIVE SLITS
- Patent Title (中): 使用被动SLITS的电导体基板的RF信号拾取
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Application No.: US14058125Application Date: 2013-10-18
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Publication No.: US20150029067A1Publication Date: 2015-01-29
- Inventor: Hawk Yin Pang , Rajiv Agarwal , Thomas Alan Donaldson
- Applicant: Hawk Yin Pang , Rajiv Agarwal , Thomas Alan Donaldson
- Applicant Address: US CA San Francisco
- Assignee: AliphCom
- Current Assignee: AliphCom
- Current Assignee Address: US CA San Francisco
- Main IPC: H01Q13/10
- IPC: H01Q13/10

Abstract:
Embodiments of the present application relate generally to electronic hardware, computer software, wireless communications, network communications, wearable, hand-held, and portable computing devices for facilitating communication of information and presentation of media. An electrically conductive substrate (e.g., a metal or metal alloy) includes an antenna formed by a slot or opening formed in the substrate, and also includes at least one separate passive slot or opening (e.g., a passive slit) formed in the substrate. The antenna may be intentionally detuned from one or more target frequencies (e.g., 802.11, 2.4 GHz, 5 GHz) such that the antenna is not optimized (e.g., is not tuned) for the one or more target frequencies. One portion of the antenna may be electrically coupled with a ground potential. Another portion of the antenna may be electrically coupled with a RF receiver, transmitter, or transceiver. The antenna may be an active antenna, a passive antenna or both.
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