Invention Application
US20140368394A1 PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS 有权
具有收发天线的集成电子电路的包装电子设备

  • Patent Title: PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS
  • Patent Title (中): 具有收发天线的集成电子电路的包装电子设备
  • Application No.: US14470893
    Application Date: 2014-08-27
  • Publication No.: US20140368394A1
    Publication Date: 2014-12-18
  • Inventor: Alberto Pagani
  • Applicant: STMICROELECTRONICS S.R.L.
  • Priority: ITTO2012A000174 20120227
  • Main IPC: H01Q1/22
  • IPC: H01Q1/22 H01L21/56 H01L25/065
PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS
Abstract:
A base carries a first chip and a second chip oriented differently with respect to the base and packaged in a package. Each chip integrates an antenna and a magnetic via. A magnetic coupling path connects the chips, forming a magnetic circuit that enables transfer of signals and power between the chips even if the magnetic path is interrupted, and is formed by a first stretch coupled between the first magnetic-coupling element of the first chip and the first magnetic-coupling element of the second chip, and a second stretch coupled between the second magnetic-coupling element of the first chip and the second magnetic-coupling element of the second chip. The first stretch has a parallel portion extending parallel to the faces of the base. The first and second stretches have respective transverse portions extending on the main surfaces of the second chip, transverse to the parallel portion.
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