Invention Application
US20140295625A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
半导体器件的制造方法

  • Patent Title: MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
  • Patent Title (中): 半导体器件的制造方法
  • Application No.: US14301521
    Application Date: 2014-06-11
  • Publication No.: US20140295625A1
    Publication Date: 2014-10-02
  • Inventor: Kenichi YOSHIMOCHI
  • Applicant: ROHM CO., LTD.
  • Priority: JP2011-128604 20110608; JP2011-142148 20110627; JP2012-111746 20120515
  • Main IPC: H01L29/06
  • IPC: H01L29/06 H01L21/762 H01L29/66
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Abstract:
A semiconductor device includes a first-conductivity-type semiconductor layer including an active region in which a transistor having impurity regions is formed and a marginal region surrounding the active region, a second-conductivity-type channel layer formed between the active region and the marginal region and forming a front surface of the semiconductor layer, at least one gate trench formed in the active region to extend from the front surface of the semiconductor layer through the channel layer, a gate insulation film formed on an inner surface of the gate trench, a gate electrode formed inside the gate insulation film in the gate trench, and at least one isolation trench arranged between the active region and the marginal region to surround the active region and extending from the front surface of the semiconductor layer through the channel layer, the isolation trench having a depth equal to that of the gate trench.
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