Invention Application
US20140276920A1 SYSTEM AND METHOD OF ABLATIVE CUTTING AND PULSED VACUUM ASPIRATION
有权
拉伸切割和脉冲真空吸收的系统和方法
- Patent Title: SYSTEM AND METHOD OF ABLATIVE CUTTING AND PULSED VACUUM ASPIRATION
- Patent Title (中): 拉伸切割和脉冲真空吸收的系统和方法
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Application No.: US13800651Application Date: 2013-03-13
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Publication No.: US20140276920A1Publication Date: 2014-09-18
- Inventor: Brandon Thomas Hendrick , Kenneth P. Grace
- Applicant: The Spectranetics Corporation
- Applicant Address: US CO Colorado Springs
- Assignee: The Spectranetics Corporation
- Current Assignee: The Spectranetics Corporation
- Current Assignee Address: US CO Colorado Springs
- Main IPC: A61B17/3207
- IPC: A61B17/3207 ; A61M1/00

Abstract:
A system for ablation and removal of occlusions from blood vessels is provided. Laser cutting systems and mechanical cutting systems are provided in catheter devices, the cutting systems operable to ablate, cut, dislodge, and otherwise remove occlusions within a blood vessel that may limit or prevent proper circulation. Pulsed aspiration systems are further provided, the pulsed aspiration systems operable to remove ablated, cut, or dislodged material without excessive or unnecessary removal of blood and fluid.
Public/Granted literature
- US09883885B2 System and method of ablative cutting and pulsed vacuum aspiration Public/Granted day:2018-02-06
Information query