A system and method for performing stress measurement on rotating parts is disclosed. The system may include a laser assembly configured to emit a laser beam, and a probe assembly mounted proximal to a rotatable part in a device. The probe assembly may be configured to output a reflected laser beam onto a first target on the rotatable part. The probe assembly may further be configured to move the reflected laser beam from the first target to a second target on the rotatable part. The probe assembly may include a redirector moveable from a first position to a second position, and a lens mounted proximal to the redirector and configured to focus the laser beam. The redirector may be configured to change the laser beam direction from a first direction to a second direction when moved from the first position to the second position.