发明申请
- 专利标题： LEAD STRUCTURE
- 专利标题（中）： 领导结构
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申请号： US14103850申请日： 2013-12-12
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公开(公告)号： US20140160708A1公开(公告)日： 2014-06-12
- 发明人: Kuan-Yu Chu , Chen-Fu Huang , Chiu-Mei Liu , Ming-Wu Chen , Chin-Pei Hwang , Chun-Cheng Huang , Yu-Ching Wang , Chung-Hsien Li , Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
- 申请人： Kuan-Yu Chu , Chen-Fu Huang , Chiu-Mei Liu , Ming-Wu Chen , Chin-Pei Hwang , Chun-Cheng Huang , Yu-Ching Wang , Chung-Hsien Li , Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
- 申请人地址： TW Taichung City
- 专利权人： WINTEK CORPORATION
- 当前专利权人： WINTEK CORPORATION
- 当前专利权人地址： TW Taichung City
- 优先权： TW101146952 20121212
- 主分类号： H02H9/02
- IPC分类号： H02H9/02
摘要：
A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.
公开/授权文献
- US2668895A Switch 公开/授权日：1954-02-09
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