Invention Application
- Patent Title: Method of Fabricating High-Density Hermetic Electrical Feedthroughs Using Insulated Wire Bundles
- Patent Title (中): 使用绝缘线束制造高密度电气馈通的方法
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Application No.: US14118183Application Date: 2012-05-16
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Publication No.: US20140144694A1Publication Date: 2014-05-29
- Inventor: Kedar G. Shah , William J. Benett , Satinderpall S. Pannu
- Applicant: Kedar G. Shah , William J. Benett , Satinderpall S. Pannu
- Priority: USPCT/US2012/038216 20110516
- International Application: PCT/US12/38216 WO 20120516
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
Public/Granted literature
- US09333337B2 Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles Public/Granted day:2016-05-10
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