Invention Application
- Patent Title: ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGE MANUFACTURING METHOD
- Patent Title (中): 电子元件封装，电子元件和电子元件封装制造方法
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Application No.: US13635024Application Date: 2012-03-16
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Publication No.: US20140083735A1Publication Date: 2014-03-27
- Inventor: Naoki Kohda , Hiroshi Yoshioka
- Applicant: Naoki Kohda , Hiroshi Yoshioka
- Applicant Address: JP Kakogawa-shi,
- Assignee: DAISHINKU CORPORATION
- Current Assignee: DAISHINKU CORPORATION
- Current Assignee Address: JP Kakogawa-shi,
- Priority: JP2011-061329 20110318
- International Application: PCT/JP2012/056873 WO 20120316
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H05K13/00
Abstract:
An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
Public/Granted literature
- US08975517B2 Electronic component package, electronic component, and electronic component package manufacturing method Public/Granted day:2015-03-10
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