Invention Application
US20140075881A1 Custom Coffered Surface Layout, Fabrication, and Installation Methods and Processes 审中-公开
定制加工表面布局,制造和安装方法和过程

  • Patent Title: Custom Coffered Surface Layout, Fabrication, and Installation Methods and Processes
  • Patent Title (中): 定制加工表面布局,制造和安装方法和过程
  • Application No.: US13783177
    Application Date: 2013-03-01
  • Publication No.: US20140075881A1
    Publication Date: 2014-03-20
  • Inventor: Jason Tilton
  • Applicant: Jason Tilton
  • Main IPC: E04F19/00
  • IPC: E04F19/00 E04F13/00
Custom Coffered Surface Layout, Fabrication, and Installation Methods and Processes
Abstract:
Systems and methods are disclosed for providing coffered ceilings with a plurality of preassembled coffered modules, each of which includes a ceiling panel precut in accordance with an order; cutting beam wall boards in accordance with the order, wherein the beam wall boards are attached to the ceiling panel and extend away from the ceiling panel; and a beam wall molding custom-fitted inside the beam wall boards. Automated systems to receive and fabricate custom coffered module orders upon payment are also disclosed.
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