发明申请
US20140015127A1 CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
审中-公开
接触支撑用于芯片半导体器件的支撑结构及其制造方法
- 专利标题： CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
- 专利标题（中）： 接触支撑用于芯片半导体器件的支撑结构及其制造方法
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申请号： US13934110申请日： 2013-07-02
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公开(公告)号： US20140015127A1公开(公告)日： 2014-01-16
- 发明人: Mark A. Bachman , Donald S. Bitting , Sailesh Chittipeddi , Seung H. Kang , Sailesh M. Merchant
- 申请人： AGERE SYSTEMS LLC
- 专利权人： AGERE SYSTEMS LLC
- 当前专利权人： AGERE SYSTEMS LLC
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
In one aspect, there is provided a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and has a contact support pillar opening formed therein. Contact support pillars that comprise a conductive metal and have a metal extension are located within the opening of the passivation layer.
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