Invention Application
- Patent Title: SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 基板结构，半导体封装及其制造方法
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Application No.: US13660249Application Date: 2012-10-25
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Publication No.: US20140008819A1Publication Date: 2014-01-09
- Inventor: Chien-Feng Chan , Chun-Tang Lin , Yi-Che Lai
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung Hsien
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung Hsien
- Priority: TW101124581 20120709
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/50 ; B32B37/12 ; H01L23/12
Abstract:
A substrate structure is provided, including a substrate and a strengthening member bonded to a surface of the substrate. The strengthening member has a CTE (Coefficient of Thermal Expansion) less than that of the substrate so as to effectively prevent warpage from occurring to the substrate structure.
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