发明申请
- 专利标题: CARRIER SUBSTRATE AND METHOD FOR PRODUCING SEMICONDUCTOR CHIPS
- 专利标题(中): 载体基板和制造半导体晶片的方法
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申请号: US13984081申请日: 2012-02-07
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公开(公告)号: US20140008770A1公开(公告)日: 2014-01-09
- 发明人: Ewald Karl Michael Günther , Andreas Plößl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
- 申请人: Ewald Karl Michael Günther , Andreas Plößl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
- 申请人地址: DE Regensburg
- 专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人地址: DE Regensburg
- 优先权: DE102011011378.9 20110216
- 国际申请: PCT/EP2012/052060 WO 20120207
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/66
摘要:
A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.
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