发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13931874申请日: 2013-06-29
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公开(公告)号: US20140008716A1公开(公告)日: 2014-01-09
- 发明人: Tsuyoshi Arigane , Digh Hisamoto , Yutaka Okuyama , Takashi Hashimoto , Daisuke Okada
- 申请人: Renesas Electronics Corporation
- 专利权人: RENESAS ELECTRONICS CORPORATION
- 当前专利权人: RENESAS ELECTRONICS CORPORATION
- 优先权: JP2012-153212 20120709
- 主分类号: H01L29/792
- IPC分类号: H01L29/792 ; H01L29/66
摘要:
When the width of an isolation region is reduced through the scaling of a memory cell to reduce the distance between the memory cell and an adjacent memory cell, the electrons or holes injected into the charge storage film of the memory cell are diffused into the portion of the charge storage film located over the isolation region to interfere with each other and possibly impair the reliability of the memory cell. In a semiconductor device, the charge storage film of the memory cell extends to the isolation region located between the adjacent memory cells. The effective length of the charge storage film in the isolation region is larger than the width of the isolation region. Here, the effective length indicates the length of the region of the charge storage film which is located over the isolation region and in which charges are not stored.
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