发明申请
- 专利标题: ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE
- 专利标题(中): 电子电路基板,显示装置和布线基板
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申请号: US14002346申请日: 2012-03-01
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公开(公告)号: US20130335940A1公开(公告)日: 2013-12-19
- 发明人: Takashi Matsui , Motoji Shiota , Hiroki Nakahama
- 申请人: Takashi Matsui , Motoji Shiota , Hiroki Nakahama
- 申请人地址: JP Osaka
- 专利权人: SHARP KABUSHIKI KAISHA
- 当前专利权人: SHARP KABUSHIKI KAISHA
- 当前专利权人地址: JP Osaka
- 优先权: JP2011047452 20110304
- 国际申请: PCT/JP2012/055266 WO 20120301
- 主分类号: H05K1/18
- IPC分类号: H05K1/18
摘要:
A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).
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