Invention Application
- Patent Title: FLAT POWER COIL FOR WIRELESS CHARGING APPLICATIONS
- Patent Title (中): 用于无线充电应用的扁平电力线圈
-
Application No.: US13982485Application Date: 2011-03-09
-
Publication No.: US20130308256A1Publication Date: 2013-11-21
- Inventor: Michael Lehr , Manjirnath Chatterjee , Dyke Shaffer , Eric Liu
- Applicant: Michael Lehr , Manjirnath Chatterjee , Dyke Shaffer , Eric Liu
- Applicant Address: US CO Fort Collins
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US CO Fort Collins
- International Application: PCT/US11/27764 WO 20110309
- Main IPC: H04B5/00
- IPC: H04B5/00

Abstract:
A coil assembly is disclosed. The coil assembly includes a coil that is provided on a substrate. The coil includes a trace element that is wound on the substrate. The trace element includes an interior gap that extends or is present along at least a portion of the trace element. The interior gap is dimensioned to reduce a presence of eddy currents that would otherwise be generated when the coil is active to inductively transmit or receive signals.
Public/Granted literature
- US09225392B2 Flat power coil for wireless charging applications Public/Granted day:2015-12-29
Information query