发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- 专利标题（中）： 半导体器件及其组装方法
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申请号： US13607731申请日： 2012-09-09
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公开(公告)号： US20130264714A1公开(公告)日： 2013-10-10
- 发明人: Guo Liang Gong , Shunan Qiu , Xuesong Xu
- 申请人： Guo Liang Gong , Shunan Qiu , Xuesong Xu
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC
- 当前专利权人地址： US TX Austin
- 优先权： CN201210131114.0 20120410
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
A semiconductor die has interface electrodes on an interface surface and an electrically conductive layer on a mounting surface that is opposite to the interface surface. The electrically conductive layer extends onto side regions of the semiconductor die. Electrical conductors couple the interface electrodes to external connector pads. A solder alloy joins the semiconductor die to a flag. The solder alloy is disposed between the flag and the electrically conductive layer and provides a joint between the flag and both the mounting surface and the side regions.
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