Invention Application
- Patent Title: BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND FABRICATING METHOD THEREOF
- Patent Title (中): 焊接结构和电子包装焊接接头结构及其制造方法
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Application No.: US13484289Application Date: 2012-05-31
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Publication No.: US20130168851A1Publication Date: 2013-07-04
- Inventor: Yu-Min Lin , Chau-Jie Zhan , Tao-Chih Chang
- Applicant: Yu-Min Lin , Chau-Jie Zhan , Tao-Chih Chang
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW100150088 20111230
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/28
Abstract:
A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode.
Public/Granted literature
- US09024441B2 Bump structure and electronic packaging solder joint structure and fabricating method thereof Public/Granted day:2015-05-05
Information query
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