发明申请
- 专利标题: POLYESTER IMIDE RESIN BASED VARNISH FOR LOW-PERMITTIVITY COATING FILM
- 专利标题(中): 基于聚酯树脂的低密度涂料薄膜
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申请号: US13818924申请日: 2011-08-23
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公开(公告)号: US20130153262A1公开(公告)日: 2013-06-20
- 发明人: Hideaki Saito , Yuudai Furuya , Kengo Yoshida , Yuji Hatanaka
- 申请人: Hideaki Saito , Yuudai Furuya , Kengo Yoshida , Yuji Hatanaka
- 申请人地址: JP OSAKA-SHI, OSAKA
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP OSAKA-SHI, OSAKA
- 优先权: JP2010-186880 20100824; JP2010-195481 20100901; JP2010-202687 20100910
- 国际申请: PCT/JP2011/068902 WO 20110823
- 主分类号: H01B3/30
- IPC分类号: H01B3/30 ; H01B3/36
摘要:
Provided are a varnish mainly containing a polyester imide and capable of forming a low-permittivity insulating layer, as well as an insulated electronic wire achieving low permittivity by using the varnish. The varnish mainly contains a polyester imide resin obtained by reacting a carboxylic acid including a dicarboxylic acid, or an anhydride or alkyl ester thereof (carboxylic acid or derivative thereof), an alcohol, and a diamine compound with one another. In the varnish, adjustment is made such that a molar ratio (OH/COOH) of hydroxyl groups of the alcohol to carboxyl groups of the carboxylic acid or derivative thereof becomes 1.9 or less or such that a content of highly polarized imide groups per unit amount of polyester imide chain is reduced by increasing molecular weights of the raw material monomers.
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