发明申请
- 专利标题： METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRESSION IN WAFER LEVEL PACKAGING PROCESS
- 专利标题（中）： 用于在水平包装过程中用焊膏球封装超薄切片的方法
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申请号： US13302219申请日： 2011-11-22
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公开(公告)号： US20130130443A1公开(公告)日： 2013-05-23
- 发明人: Jun Lu , Alex Niu , Yueh-Se Ho , Ping Huang , Jacky Gong , Yan Xun Xue , Xiaotian Zhang , Ming-Chen Lu
- 申请人： Jun Lu , Alex Niu , Yueh-Se Ho , Ping Huang , Jacky Gong , Yan Xun Xue , Xiaotian Zhang , Ming-Chen Lu
- 主分类号： H01L21/78
- IPC分类号： H01L21/78
摘要：
The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.
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