发明申请
- 专利标题： SEMICONDUCTOR DEVICE HAVING MULTIPLE BUMP HEIGHTS AND MULTIPLE BUMP DIAMETERS
- 专利标题（中）： 具有多个高度和多个直径的半导体器件
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申请号： US13543907申请日： 2012-07-09
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公开(公告)号： US20130087910A1公开(公告)日： 2013-04-11
- 发明人: RAMLAH BINTE ABDUL RAZAK
- 申请人： RAMLAH BINTE ABDUL RAZAK
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A semiconductor die includes a first contact stack including a first UBM pad on a first die pad, a second contact stack including a second UBM pad on a second die pad, and a third contact stack including a third UBM pad on a third die pad. The second UBM pad perimeter is shorter than the first UBM pad perimeter, and the third UBM pad perimeter is longer than the second UBM pad perimeter. A first solder bump is on the first UBM pad, a second solder bump is on the second UBM pad, and a third solder bump is on the third UBM pad. The first solder bump, second solder bump and third solder bump all have different sizes.
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