发明申请
US20130075876A1 SEALED POROUS MATERIALS, METHODS FOR MAKING THEM, AND SEMICONDUCTOR DEVICES COMPRISING THEM
有权
密封多孔材料，制造它们的方法以及包含它们的半导体器件
- 专利标题： SEALED POROUS MATERIALS, METHODS FOR MAKING THEM, AND SEMICONDUCTOR DEVICES COMPRISING THEM
- 专利标题（中）： 密封多孔材料，制造它们的方法以及包含它们的半导体器件
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申请号： US13622141申请日： 2012-09-18
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公开(公告)号： US20130075876A1公开(公告)日： 2013-03-28
- 发明人: Frederik Goethals , Pascal Van Der Voort , Isabel Van Driessche , Mikhail Baklanov
- 申请人： IMEC , Universiteit Gent
- 申请人地址： BE Gent BE Leuven
- 专利权人： Universiteit Gent,IMEC
- 当前专利权人： Universiteit Gent,IMEC
- 当前专利权人地址： BE Gent BE Leuven
- 主分类号： H01L21/312
- IPC分类号： H01L21/312 ; H01L23/29
摘要：
A method for at least partially sealing a porous material is provided, comprising forming a sealing layer onto the porous material by applying a sealing compound comprising oligomers wherein the oligomers are formed by ageing a precursor solution comprising cyclic carbon bridged organosilica and/or bridged organosilanes. The method is especially designed for low k dielectric porous materials to be incorporated into semiconductor devices.
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