发明申请
- 专利标题: SILICON CARBIDE SUBSTRATE, SILICON CARBIDE SUBSTRATE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 专利标题(中): 硅碳化硅基板,碳化硅基板制造方法和半导体器件制造方法
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申请号: US13599278申请日: 2012-08-30
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公开(公告)号: US20130056752A1公开(公告)日: 2013-03-07
- 发明人: Shinsuke Fujiwara , Shin Harada
- 申请人: Shinsuke Fujiwara , Shin Harada
- 申请人地址: JP Osaka-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2011-193463 20110906
- 主分类号: H01L29/38
- IPC分类号: H01L29/38 ; H01L21/78
摘要:
An edge region has a width of 5 mm. A valid region is surrounded by the edge region, and has an area greater than or equal to 100 cm2. At the valid region, a micropipe having a cross-sectional area exceeding 1 μm2 is not present. The valid region includes a plurality of high-quality regions occupying 70% or more of the valid region. Each of the plurality of high-quality regions has a square shape, an area greater than or equal to 1 cm2, and a micropipe density less than or equal to 1 micropipe per 1 cm2.
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