发明申请
- 专利标题： SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BONDING APPARATUS, AND SUBSTRATE SEPARATING METHOD
- 专利标题（中）： 基板分离装置，负载锁定装置，基板结合装置和基板分离方法
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申请号： US13594151申请日： 2012-08-24
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公开(公告)号： US20130048222A1公开(公告)日： 2013-02-28
- 发明人: Keiichi TANAKA , Masahiro YOSHIHASHI
- 申请人： Keiichi TANAKA , Masahiro YOSHIHASHI
- 优先权： JP2010-040104 20100225
- 主分类号： B32B38/10
- IPC分类号： B32B38/10
摘要：
A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.
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