A high-temperature solder with multi-layer structure and method for manufacturing the same are disclosed. The high-temperature solder with multi-layer structure comprises: at least one first substrate and a second substrate. Wherein a first metal layer is formed on one surface of the first substrate by way of electroplating, and a second metal layer and a third metal layer are sequentially formed on the two surfaces of the second substrate through the electroplating. The first substrate is stacked on the third metal layer of the second substrate by the surface thereof provided with the first metal layer, so that the third metal layer and the first metal layer may jointly form an intermetallic (IMC) layer by way of the solid-liquid interdiffusion joint, in which the IMC layer includes at least one intermetallic compound for making the melting point of the high-temperature solder with multi-layer structure higher than 300-deg Celsius.