发明申请
- 专利标题: THERMALLY CONDUCTIVE ADHESIVE SHEET
- 专利标题(中): 导热粘合片
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申请号: US13642918申请日: 2011-05-13
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公开(公告)号: US20130041093A1公开(公告)日: 2013-02-14
- 发明人: Junichi Nakayama , Tatsuya Tsukagoshi , Yoshio Terada , Akira Shouji , Kenji Furuta , Midori Tojo
- 申请人: Junichi Nakayama , Tatsuya Tsukagoshi , Yoshio Terada , Akira Shouji , Kenji Furuta , Midori Tojo
- 申请人地址: JP Ibaraki-shi, Osaka
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Ibaraki-shi, Osaka
- 优先权: JP2010-115603 20100519; JP2010-115604 20100519
- 国际申请: PCT/JP2011/061064 WO 20110513
- 主分类号: C09J133/08
- IPC分类号: C09J133/08
摘要:
An object is to provide a thermally conductive adhesive sheet capable of making a heat generating body and a heat radiating body adhere to each other easily and with a sufficient adhesive force. Provided is a thermally conductive adhesive sheet including an adhesive agent layer formed by molding a thermally conductive adhesive agent composition including an acrylic polymer component into a sheet-like shape, wherein the adhesive force at the time of 180° peeling is 1 N/20 mm or more and the contact thermal resistance is 0.6 cm2·K/W or less when the adhesive sheet is pressure bonded to an adherend with a pressure of 200 kPa.
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