Invention Application
- Patent Title: LEVELER COMPOUNDS
- Patent Title (中): 水平化合物
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Application No.: US13609267Application Date: 2012-09-11
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Publication No.: US20130001088A1Publication Date: 2013-01-03
- Inventor: Deyan Wang , Robert D. Mikkola , George G. Barclay
- Applicant: Deyan Wang , Robert D. Mikkola , George G. Barclay
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/00 ; C25D3/02
Abstract:
Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
Public/Granted literature
- US08506788B2 Leveler compounds Public/Granted day:2013-08-13
Information query
