A method, apparatus and system for cooling a component of a downhole tool is disclosed. The apparatus includes a first desiccant configured to adsorb a refrigerant gas. A transmitter is configured to transmit electromagnetic energy into the first desiccant to enable desorption of the refrigerant gas from the first desiccant. A condenser condenses the desorbed refrigerant gas into a liquid phase. The condensed refrigerant evaporates from a liquid phase to a gaseous phase to cool the component. A second desiccant can be used, wherein the processor is configured to operate the cooling system in a first mode of operation in which the first desiccant is in thermal communication with the component and the second desiccant is thermally isolated from the component and a second mode of operation in which the second desiccant is in thermal communication with the component and the first desiccant is thermally isolated from the component.