Invention Application
US20120273935A1 Semiconductor Device and Method of Making a Semiconductor Device
审中-公开
半导体器件及制造半导体器件的方法
- Patent Title: Semiconductor Device and Method of Making a Semiconductor Device
- Patent Title (中): 半导体器件及制造半导体器件的方法
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Application No.: US13097851Application Date: 2011-04-29
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Publication No.: US20120273935A1Publication Date: 2012-11-01
- Inventor: Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
- Applicant: Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/50 ; H01L21/78
Abstract:
A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
Information query
IPC分类:
