发明申请
- 专利标题： LED STRUCTURE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： LED结构及其制造方法
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申请号： US13128102申请日： 2011-04-14
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公开(公告)号： US20120256213A1公开(公告)日： 2012-10-11
- 发明人: Kuangyao Chang , Chechang Hu , Jing Zhang
- 申请人： Kuangyao Chang , Chechang Hu , Jing Zhang
- 申请人地址： CN Shenzhen, Guangdong
- 专利权人： SHENZHEN CHINA STAR OPTOELECTONICS TECHNOLOGY CO., LTD.
- 当前专利权人： SHENZHEN CHINA STAR OPTOELECTONICS TECHNOLOGY CO., LTD.
- 当前专利权人地址： CN Shenzhen, Guangdong
- 优先权： CN201110087917.6 20110408
- 国际申请： PCT/CN11/72813 WO 20110414
- 主分类号： H01L33/50
- IPC分类号： H01L33/50 ; H01L33/48
摘要：
The present invention discloses an LED structure and a manufacturing method thereof. The LED structure has a housing, an LED chip and a transparent encapsulant. The housing has a recess and at least one protruded wall. The LED chip is received in the recess. The transparent encapsulant is formed by dispensing a molding compound into the recess by an adhesive dispenser. The transparent encapsulant has an edge matched with an edge of the recess to encapsulate the LED chip in the recess, and has a height smaller than that of the protruded wall. The LED chip of the LED structure of the present invention can emit light through the spherical surface of the transparent encapsulant based on a greater visual angle, and thus enhance the light extraction efficiency.
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