发明申请
US20120251789A1 PRESSURING MODULE, PRESSURING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE BONDING METHOD, AND BONDED SUBSTRATE
审中-公开
压力模块，压力装置，基板结合装置，基板结合方法和粘结基板
- 专利标题： PRESSURING MODULE, PRESSURING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE BONDING METHOD, AND BONDED SUBSTRATE
- 专利标题（中）： 压力模块，压力装置，基板结合装置，基板结合方法和粘结基板
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申请号： US13431764申请日： 2012-03-27
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公开(公告)号： US20120251789A1公开(公告)日： 2012-10-04
- 发明人: Keiichi TANAKA , Shigeto Izumi
- 申请人： Keiichi TANAKA , Shigeto Izumi
- 优先权： JP2009-223344 20090928; JP2009-233882 20091007; JP2009-233885 20091007
- 主分类号： B32B37/10
- IPC分类号： B32B37/10 ; B32B3/30
摘要：
A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.
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