发明申请
- 专利标题: MICROSTRUCTURE MANUFACTURING METHOD
- 专利标题(中): 微结构制造方法
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申请号: US13399651申请日: 2012-02-17
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公开(公告)号: US20120219916A1公开(公告)日: 2012-08-30
- 发明人: Takayuki Teshima , Yutaka Setomoto
- 申请人: Takayuki Teshima , Yutaka Setomoto
- 申请人地址: JP Tokyo
- 专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-038559 20110224
- 主分类号: G03F7/20
- IPC分类号: G03F7/20
摘要:
A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution.
公开/授权文献
- US09040227B2 Microstructure manufacturing method 公开/授权日:2015-05-26
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