Invention Application
- Patent Title: MOBILE COMPUTING APPARATUS
- Patent Title (中): 手机计算机
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Application No.: US13176390Application Date: 2011-07-05
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Publication No.: US20120194995A1Publication Date: 2012-08-02
- Inventor: Feng-Ku Wang , Yi-Lun Cheng
- Applicant: Feng-Ku Wang , Yi-Lun Cheng
- Applicant Address: TW Taipei
- Assignee: INVENTEC CORPORATION
- Current Assignee: INVENTEC CORPORATION
- Current Assignee Address: TW Taipei
- Priority: TW100103734 20110131
- Main IPC: G06F1/20
- IPC: G06F1/20

Abstract:
A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.
Public/Granted literature
- US08482916B2 Mobile computing apparatus Public/Granted day:2013-07-09
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