Invention Application
- Patent Title: APPARATUS FOR THERMAL MELTING PROCESS AND METHOD OF THERMAL MELTING PROCESS
- Patent Title (中): 热熔融工艺的方法和热熔方法
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Application No.: US13392303Application Date: 2010-08-24
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Publication No.: US20120153010A1Publication Date: 2012-06-21
- Inventor: Hideyuki Abe
- Applicant: Hideyuki Abe
- Priority: JP2009-196687 20090827; JP2009-254255 20091105
- International Application: PCT/JP10/64299 WO 20100824
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K3/08 ; F27B9/06
Abstract:
Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
Public/Granted literature
- US08864011B2 Apparatus for thermal melting process and method of thermal melting process Public/Granted day:2014-10-21
Information query
IPC分类:
