Invention Application
- Patent Title: THERMOSETTING DIE-BONDING FILM
- Patent Title (中): 热成型贴膜
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Application No.: US13365071Application Date: 2012-02-02
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Publication No.: US20120135242A1Publication Date: 2012-05-31
- Inventor: Yuki SUGO , Sadahito MISUMI , Takeshi MATSUMURA
- Applicant: Yuki SUGO , Sadahito MISUMI , Takeshi MATSUMURA
- Priority: JP2008-219989 20080828; JP2009-159125 20090703
- Main IPC: B32B27/38
- IPC: B32B27/38 ; C08L63/00
Abstract:
The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.
Public/Granted literature
- US08580617B2 Thermosetting die-bonding film Public/Granted day:2013-11-12
Information query
