Invention Application
US20120126379A1 DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
审中-公开
DIE BOND FILM，DICING DIE BOND FILM，METHOD OF MANUFACTURING DIE BOND FILM，和SEMICONDUCTOR DEVICE WITH DIE BOND FILM
- Patent Title: DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
- Patent Title (中): DIE BOND FILM，DICING DIE BOND FILM，METHOD OF MANUFACTURING DIE BOND FILM，和SEMICONDUCTOR DEVICE WITH DIE BOND FILM
-
Application No.: US13298613Application Date: 2011-11-17
-
Publication No.: US20120126379A1Publication Date: 2012-05-24
- Inventor: Daisuke UENDA , Takeshi MATSUMURA , Koichi INOUE , Miki MORITA
- Applicant: Daisuke UENDA , Takeshi MATSUMURA , Koichi INOUE , Miki MORITA
- Priority: JP2010-258066 20101118
- Main IPC: H01L23/552
- IPC: H01L23/552 ; B32B37/14 ; B32B37/12 ; C23C16/44 ; B32B7/12 ; C09J7/02
Abstract:
A semiconductor device having an electromagnetic wave shielding layer can be manufactured without decreasing productivity. The present invention provides a die bond film including an adhesive layer and an electromagnetic wave shielding layer made of a metal foil or a die bond film including an adhesive layer and an electromagnetic wave shielding layer formed by vapor deposition.
Information query
IPC分类:
