发明申请
- 专利标题： LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- 专利标题（中）： 用于半导体制造的聚酰亚胺的激光吸附
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申请号： US13285408申请日： 2011-10-31
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公开(公告)号： US20120111496A1公开(公告)日： 2012-05-10
- 发明人: Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
- 申请人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 优先权： CA2719927 20101105
- 主分类号： B32B38/10
- IPC分类号： B32B38/10 ; B29C35/08
摘要：
A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
公开/授权文献
- US08999107B2 Laser ashing of polyimide for semiconductor manufacturing 公开/授权日：2015-04-07
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