Invention Application
- Patent Title: METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR
- Patent Title (中): 固体电解电容器的制造方法
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Application No.: US13270951Application Date: 2011-10-11
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Publication No.: US20120084954A1Publication Date: 2012-04-12
- Inventor: Tai Yon Cho , Kwan Hyeong Kim , Jae Bum Cho , Jeong Oh Hong
- Applicant: Tai Yon Cho , Kwan Hyeong Kim , Jae Bum Cho , Jeong Oh Hong
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2010-0099395 20101012
- Main IPC: H01G9/00
- IPC: H01G9/00

Abstract:
There is provided a method of manufacturing a solid electrolytic capacitor including: forming a conductive polymer layer on a surface of a metal pellet; and forming a dielectric layer between the metal pellet and the conductive polymer layer. Because the conductive polymer layer is directly formed on the surface of the metal pellet, the conductive polymer layer can be uniformly formed, and because there is no need to form an electrode on the surface of the dielectric layer, the process can be reduced. In addition, because the uniform polymer film is formed irrespective of the size of metal pores and the shape of the capacitor, a capacity of the capacitor can be maximized.
Information query