Invention Application
- Patent Title: METHOD FOR MOLECULAR ADHESION BONDING AT LOW PRESSURE
- Patent Title (中): 低压分子粘合方法
-
Application No.: US13192312Application Date: 2011-07-27
-
Publication No.: US20120038027A1Publication Date: 2012-02-16
- Inventor: Marcel Broekaart
- Applicant: Marcel Broekaart
- Priority: FRFR1056566 20100811
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L29/06
Abstract:
The present invention relates to a method for molecular adhesion bonding between at least a first wafer and a second wafer involving aligning the first and second wafers, placing the first and second wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure; bringing the first wafer and the second wafer into alignment and contact; and initiating the propagation of a bonding wave between the first and second wafer after the wafers are aligned and in contact by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure. The invention also relates to the three-dimensional composite structure that is obtained by the described method of adhesion bonding.
Public/Granted literature
- US08338266B2 Method for molecular adhesion bonding at low pressure Public/Granted day:2012-12-25
Information query
IPC分类:
